Precision-Crafted BGA Reballing Stencil Platform
High-grade stainless steel construction ensures durability and precise alignment for iPhone X-15 Pro Max motherboard repairs. Laser-cut openings guarantee flawless solder ball placement during reballing.
Universal 24-in-1 Compatibility
Includes interchangeable middle layers for multiple iPhone models, reducing tool clutter. Perfect for professional repair shops and microsoldering technicians handling high-volume jobs.
Anti-Warp Flat Base Design
Machined aluminum platform prevents flex during heating, critical for consistent BGA rework. Ideal for reballing chips, replacing ICs, or salvaging water-damaged boards.
Quick-Clip Fixture System
Tool-free clamping secures PCBs instantly, boosting workshop efficiency. Compatible with most third-party heating plates and rework stations.
OEM-Level Accuracy
Tolerance within ±0.01mm matches factory solder mask specifications. Essential for repairing boot loops, touch disease, or baseband faults in modern iPhones.