Recent Purchase
hbv***
Wheel Diameter:default;RPM:default;Abrasive:default;
$154.20
19 days ago
rst***
Wheel Diameter:default;RPM:default;Abrasive:default;
$346.95
19 days ago
bvg***
Wheel Diameter:default;RPM:default;Abrasive:default;
$154.20
49 days ago
ygs***
Wheel Diameter:default;RPM:default;Abrasive:default;
$269.85
41 days ago
fmt***
Wheel Diameter:default;RPM:default;Abrasive:default;
$269.85
1 day ago
gvm***
Wheel Diameter:default;RPM:default;Abrasive:default;
$38.55
23 days ago
anu***
Wheel Diameter:default;RPM:default;Abrasive:default;
$308.40
41 days ago
kqc***
Wheel Diameter:default;RPM:default;Abrasive:default;
$269.85
15 days ago
zwf***
Wheel Diameter:default;RPM:default;Abrasive:default;
$231.30
32 days ago
uqi***
Wheel Diameter:default;RPM:default;Abrasive:default;
$192.75
3 days ago
View All
Customer Reviews
Diamond Dicing Blades for Sapphire Wafer from Chinese Factory with High Quality
$38.55
Wheel Diameter:
default
Abrasive:
default
RPM:
default
Quantity:
Add to Cart
Wishlist
Features
High-Precision Diamond Dicing Blades for Sapphire Wafers
Ultra-thin diamond coating ensures superior cutting accuracy and extended blade life, ideal for precision dicing of sapphire wafers in semiconductor and LED industries. Premium electroplated nickel bond enhances durability, reducing chipping and cracking for flawless wafer edges in high-volume production. Engineered with uniform grit distribution for smooth, burr-free cuts, minimizing material waste and maximizing yield in advanced electronics manufacturing. Exclusive high-speed compatible design maintains stability even under intense thermal stress, perfect for industrial laser dicing systems. Direct factory pricing with bulk discounts available, backed by global wholesale supply chain for fast, reliable delivery.
See More
Description
Shipping & Delivery
