Professional-Grade IR Hot Air Rework Station for Precision Electronics Repair

High-Precision Infrared Heating Technology

Equipped with advanced infrared heating system for uniform temperature distribution, ideal for BGA rework and IC chip soldering. Features adjustable airflow control (0-120L/min) and temperature range up to 480°C for delicate component handling.

Industrial-Strength Build with Ceramic Heating Core

Military-grade ceramic heating element ensures rapid heat-up (under 30 seconds) and extended lifespan. Reinforced steel nozzle resists oxidation for consistent performance during prolonged PS4/PS5 or laptop motherboard repairs.

Multi-Application Workhorse

Optimized for gaming console chip replacement, smartphone PCB reballing, and SMD component removal. Includes anti-static silicone mat and micro-quartz IR emitter for sensitive IC chips.

Ergonomic Swiss-Style Design

Lightweight aluminum body with rotary encoder knob for single-hand operation during intricate soldering tasks. Integrated sleep mode prevents accidental overheating during workshop use.