High Temperature Main Motherboard NAND IC Chip Fixture Holder Clamp

Premium BGA Repair Tool for iPhone with heat-resistant stainless steel frame ensures stability during high-temperature soldering. Precision-machined aluminum alloy base provides even heat distribution for flawless chip reballing. Anti-slip silicone pads protect delicate motherboard components from scratches.

Professional-grade fixture compatible with iPhone 6 through iPhone 14 Pro Max models. Essential for microsoldering labs, repair shops, and electronics manufacturers performing NAND chip replacements or data recovery.

Ergonomic spring-loaded clamp mechanism allows single-handed operation while maintaining consistent pressure. Includes magnetic positioning guides for accurate BGA chip alignment every time. Anodized surface prevents oxidation for long-term durability.

Optimized airflow design prevents heat buildup during prolonged use. Works seamlessly with hot air stations, infrared rework systems, and standard BGA reballing equipment. CNC-milled tolerances within 0.01mm ensure perfect contact with logic boards.

Ultimate solution for secure chip mounting during reflow, programming, or underfill processes. Military-grade fasteners withstand repeated thermal cycles without loosening. Mirror-polished contact surfaces prevent residue buildup for maintenance-free operation.