Precision Laser Alignment
– Equipped with advanced infrared laser technology for pinpoint accuracy in IC chip desoldering and reballing, ensuring minimal heat damage to sensitive components.
Universal Compatibility
– Designed for SMD and BGA rework on mobile phones, laptops, and other fine-pitch electronics, supporting a wide range of chip sizes and configurations.
Automated Temperature Control
– Features intelligent IR heating with adjustable settings for consistent solder melting, preventing overheating and board warping during repairs.
High-Quality Construction
– Built with industrial-grade materials, including a durable stainless steel frame and ceramic heating elements for long-lasting performance in professional workshops.
Efficient Rework Station
– Streamlines chip removal and reballing with integrated vacuum suction and precision nozzles, reducing downtime for high-volume repair services.
User-Friendly Interface
– Simplifies complex tasks with an intuitive LCD display and programmable presets, ideal for both beginners and experienced technicians.