DH-5830 IC Reball BGA Rework Station for Cell Phone Repair
Precision-engineered for professional-grade IC rework, this BGA station features a high-performance heating system with adjustable temperature (100-500°C) and rapid heat recovery. The advanced infrared preheater ensures even heat distribution, preventing PCB warping. Built with industrial-grade aluminum alloy and ceramic heating elements for durability and consistent thermal performance. Includes a high-accuracy digital temperature controller (±1°C) and vacuum suction tool for seamless BGA chip removal. Ideal for repairing smartphones, tablets, and gaming consoles—perfect for microsoldering, reballing, and reflowing BGA, QFN, and CSP chips. Compatible with lead-free and leaded solder, making it versatile for modern and legacy devices. Global wholesale pricing ensures unbeatable value for bulk orders, backed by fast logistics and reliable support. Upgrade your repair toolkit with this all-in-one rework solution.