High-Performance Thermal Conductive Gel for Precision Electronics
Premium silicone-based thermal gel ensures optimal heat dissipation for high-power electronic components. Formulated with ultra-fine particles for seamless gap filling, reducing thermal resistance by up to 30% compared to standard pastes.
Engineered for Durability & Stability
Non-drying, non-corrosive formula maintains viscosity under extreme temperatures (-40°C to 200°C). Reinforced with ceramic microspheres for long-term conductivity without pump-out effect.
Universal Application Scenarios
Ideal for mobile phone motherboards, CPU/GPU chips, solar module junctions, and automotive electronics. Ensures stable performance in gaming devices, IoT hardware, and industrial equipment.
Precision Packaging & Hassle-Free Use
Syringe-style dispensing allows millimeter-level accuracy. Zero curing time—ready for immediate operation after application. Compatible with automated assembly lines for bulk processing.
Bulk Supply Advantage
Direct factory pricing with MOQ flexibility. Customizable viscosity (5W-15W) for specialized projects. ISO-certified production ensures batch consistency.