High-Precision Thin Blade: Ultra-thin 0.1mm stainless steel blade for precise iPhone CPU/IC chip glue removal without motherboard damage.

Multi-Function Design: Includes specialized tools for scraping, lifting, and cleaning during delicate motherboard repairs.

Professional-Grade Material: High-carbon steel construction with anti-rust coating ensures durability for repeated PCB repair tasks.

Ergonomic Non-Slip Handle: Textured rubber grip provides perfect control during intricate microsoldering operations.

Complete Repair Solution: Essential for iPhone screen replacement, chip reballing, and BGA component repairs in professional workshops.

Industry-Standard Quality: Mirror-polished edges maintain sharpness through 500+ uses, outperforming generic plastic pry tools.

Space-Saving Kit: Compact 8-piece set organizes neatly in repair toolkits for mobile technicians and electronics engineers.

Certified OEM Product: Genuine QianLi 009 series with laser-etched serial numbers for authenticity verification.