Precision Infrared Heating Technology with 8500W power ensures uniform temperature distribution for flawless BGA rework on laptop motherboards and mobile PCBs

High-grade stainless steel nozzle and ceramic heating element provide durability and consistent performance in high-temperature soldering and reballing applications

Multi-zone temperature control (200°C-500°C) with digital display enables precise adjustments for various IC chip sizes and solder types

Industrial-grade aluminum alloy body with ergonomic handle design ensures heat resistance and comfortable operation during prolonged repair sessions

Includes specialized vacuum suction tool and solder paste dispenser for efficient component removal and reballing processes

220V voltage compatibility with built-in surge protection meets global workshop safety standards for professional electronics repair technicians

Complete rework station solution ideal for repairing gaming consoles, smartphone logic boards, and high-density PCB assemblies in repair shops and manufacturing facilities