MECHANIC IX5 Ultra Universal Preheating Platform
Precision-engineered for mobile phone motherboard repair, featuring an ultra-durable aluminum alloy heating plate with advanced temperature control (50°C–450°C). Ensures even heat distribution to safely remove layered bonding glue and delaminate components without damage. Equipped with a high-sensitivity LCD touchscreen for real-time adjustments and auto-sleep function for energy efficiency. Non-slip silicone mat included for secure device placement during delicate repairs. Ideal for professional technicians handling iPhone, Samsung, and other PCB repairs—perfect for micro-soldering, BGA rework, and adhesive removal. Compact yet powerful, designed for workshop or on-the-go repair efficiency. Global wholesale pricing available—bulk orders welcome. Trusted by repair shops worldwide for reliability and performance.