Professional-grade 859D Smart Hot Air Desoldering Station engineered for precision PCB and IC repair. Features advanced constant temperature control with rapid heating ceramic core technology, ensuring stable airflow up to 480°C for flawless component removal. Industrial-grade aluminum alloy housing with ergonomic grip design reduces fatigue during extended mobile phone motherboard repairs. Integrated vacuum suction function effortlessly clears molten solder residues. Calibrated digital display enables exact temperature adjustments for delicate BGA chip rework. Dual-layer insulated nozzle set included for versatile applications across SMD components and through-hole joints. ESD-safe construction protects sensitive electronics during laptop or gaming console PCB reflow. Backed by wholesale pricing for repair shops and bulk buyers requiring reliable soldering equipment. Ideal for professional technicians handling high-volume smartphone microsoldering or industrial PCB rework stations.