Multipurpose Nanosponge for Precision Electronics Maintenance

Ultra-fine porous structure effectively removes stubborn OCA glue residue and contaminants without scratching delicate surfaces. Specially formulated high-density material ensures durability through repeated use on mobile phone motherboards and screens.

Non-abrasive texture safely cleans intricate circuit board components while absorbing excess oils and dust particles. Ideal for professional repair technicians and DIY enthusiasts handling device disassembly.

Heat-resistant composition withstands moderate temperatures during soldering or heat gun applications. Compact block design allows precise edge cleaning and fits standard workshop toolkits.

Bulk packaging available for repair shops and wholesale buyers seeking cost-effective maintenance solutions. Certified static-free material prevents accidental damage to sensitive electronic parts.