Premium Infrared Heating Technology - High-precision temperature control with uniform heating for flawless BGA rework, eliminating cold spots and ensuring consistent solder reflow. Ideal for delicate motherboard repairs.

Industrial-Grade Construction - Heavy-duty steel frame with ceramic-insulated heating elements for durability and heat retention. Precision-engineered nozzles accommodate various chip sizes (15x15mm to 50x50mm).

Smart Curve Welding System - Pre-programmed reflow profiles for lead-free/traditional solder, with real-time thermal feedback. Reduces human error in reballing CPUs/GPUs on laptops/PCBs.

Multi-Scene Adaptability - From workshop repairs to production line rework. Compatible with QFN, BGA, and CSP chips. Includes anti-static mat and vacuum pickup tool for component handling.

Wholesale-Optimized - Bulk pricing for repair shops/manufacturers. Ships with calibration certificate and 6-month warranty. Voltage: 110V/220V auto-switching. Weight: 18.5kg (station + accessories).