MIJING RC11 3D Infrared Thermal Imaging Camera Analyzer
Precision-engineered with high-resolution infrared sensors for detecting micro-level temperature variations on mobile PCBs. Advanced 3D imaging technology visualizes heat distribution in real time, ideal for diagnosing short circuits, component failures, and power leaks. Durable aerospace-grade aluminum alloy housing ensures shock resistance and heat dissipation. Ultra-lightweight design (under 300g) with ergonomic grip for prolonged repair sessions. Compatible with Android/iOS via low-latency wireless connectivity. Perfect for professional technicians, repair shops, and electronics manufacturers. Streamline fault detection in smartphones, tablets, and IoT devices—cut diagnostic time by 70%. Bulk orders available at unmatched wholesale rates.