Premium 50g YCS Solder Paste for Precision BGA & PCB Repairs

High-purity tin alloy formulation ensures flawless ball planting and reliable solder joints for CPU/GPU chips and mobile motherboards

Ultra-fine 138-183-150 mesh particle size delivers smooth application and optimal reflow performance in tight-spaced BGA work

Industrial-grade flux core eliminates oxidation during reballing, preventing voiding and cold joints in smartphone repair scenarios

Precision syringe packaging allows controlled dispensing for micro-soldering tasks on SMD components and PCB trace repairs

Stable viscosity maintains perfect consistency across lead-free soldering temperatures (217°C+) for professional workshop use

ESD-safe formulation protects sensitive electronics during motherboard rework and gaming console repairs

Trusted by repair technicians for PS5/Xbox chip fixes, MacBook logic board reviving, and drone circuit restoration