Precision Desoldering for Professional Repairs
Upgrade your repair toolkit with the 2023 Mijing iRepair MS1 Desoldering Platform, engineered for flawless motherboard repairs on iPhone X–13 Pro Max. Its advanced ceramic heating element ensures even heat distribution (200°C–450°C adjustable) to safely remove chips without damaging delicate circuits.
Industrial-Grade Build for Durability
Featuring an aluminum alloy chassis and silicone-insulated handles, this station withstands daily workshop use. The anti-static mat and vacuum suction nozzle (included) enhance precision during micro-soldering tasks.
Smart Efficiency for High-Volume Work
The rapid 30-second preheating function and auto-cooling system streamline repetitive repairs, ideal for repair shops or bulk device refurbishing. Compatible with BGA and SMD components.
Ergonomic Safety Meets Pro Performance
Integrated ESD protection and a tilt-resistant base minimize accidents. The LED temperature display and dual-heat-zone control cater to both beginners and seasoned technicians.
Unbeatable Value for Bulk Buyers
Direct-from-factory pricing ensures the lowest global rates—stock up for your team without compromising quality. Ships ready for immediate deployment in labs, factories, or resale.