Precision-Grade Preheating Platform for Mobile Phone Repairs
Engineered with aerospace-grade aluminum alloy for rapid heat conduction and uniform temperature distribution, ensuring flawless motherboard rework.
Ultra-Universal Compatibility
Fits 99% of smartphone models with adjustable clamps and non-slip silicone pads, ideal for BGA reballing, IC replacements, and display delamination.
Smart Dual-Temperature Control
Digital PID thermostat (50–450°C ±2°C) paired with ceramic heating elements prevents overheating damage to delicate PCB components.
Industrial-Grade Stability
Reinforced steel base with anti-tilt design handles continuous 12-hour workloads, perfect for repair shops and microsoldering labs.
Quick-Swap Modular Design
Interchangeable nozzle attachments streamline glue removal, tin planting, and laminated screen separations—no downtime between tasks.
Certified Safe Operation
CE/FCC-compliant with auto-shutoff and ESD protection, eliminating risks of short circuits during high-precision repairs.
Bulk Purchase Advantage
Direct factory pricing with volume discounts—stock up for your repair business without middleman markups.