Universal BGA Reballing Stencil for Motherboard Repair

Precision-engineered stainless steel stencil with laser-cut openings for accurate solder ball placement during BGA rework. Compatible with WDS-520 and other rework stations, ensuring seamless integration.

High-temperature resistant design withstands repeated reflow cycles without warping. Micro-fine thickness (0.1mm) guarantees consistent solder volume for flawless motherboard and GPU chip repairs.

Essential for professional electronics repair shops, PCB rework stations, and industrial maintenance teams. Ideal for smartphones, gaming consoles, and laptop motherboard reballing.

Direct factory pricing with bulk order discounts available. Ships globally with OEM-quality assurance and 24/7 technical support. Upgrade your repair toolkit with professional-grade durability.