Precision-Crafted Glue Removal Blades for Electronics Repair

Ultra-thin stainless steel blades (0.05mm thickness) with laser-sharpened edges ensure scratch-free removal of adhesives from CPU/IC chips. Mirror-polished surface prevents static buildup during delicate PCB work.

Professional-grade flexibility withstands 15,000+ repeated bends without fracture. Angulated tip design accesses tight spaces under BGA chips and display connectors.

Essential for smartphone microsoldering, laptop chip reballing, and industrial SMT component replacement. Compatible with all major rework stations and manual repair kits.

Bulk packaging (100 blades/unit) reduces per-use cost by 73% vs retail alternatives. Vacuum-sealed moisture-proof sleeves maintain blade integrity during storage.