High-Precision Temperature Control - Advanced PID algorithm ensures ultra-stable heating with ±2℃ accuracy, ideal for delicate motherboard component repair.

Industrial-Grade Aluminum Alloy Heating Plate - CNC-machined 150x100mm surface with anti-oxidation coating guarantees even heat distribution and long-term durability.

Multi-Layer Insulated Handle - Ergonomically designed with fiberglass-reinforced silicone grip prevents heat transfer during prolonged BGA rework sessions.

Dual-Zone Preheating System - Independent upper/lower heating zones (50-450℃ adjustable) accommodate various PCB sizes from smartphones to tablet logic boards.

Intelligent Safety Protections - Built-in overheat cutoff, surge protection and automatic cool-down function meet CE/ROHS certification standards.

Professional Rework Station Configuration - Includes magnetic tool holder, removable flux tray and grounded soldering iron port for full repair workstation setup.

Versatile Application Scenarios - Perfect for micro-soldering (iPhone touch IC, MacBook RAM chips), BGA reballing, and LCD/LED component replacements in repair shops.

Commercial-Grade Components - Japanese-made heating elements and German thermal sensors ensure 50,000+ cycle lifespan under heavy daily use.