Key Features of SuperCam X 3D Thermal Infrared Imager Camera
High-resolution thermal imaging with precise 3D visualization for detecting minute temperature variations in electronic components. Durable aerospace-grade aluminum alloy housing ensures shock resistance and long-term reliability in demanding environments. Ultra-sensitive infrared sensor captures thermal patterns up to 0.05°C accuracy, ideal for PCB fault diagnosis and motherboard repair. Seamless smartphone integration via dedicated app for real-time analysis, reporting, and image sharing. Multi-scenario application: circuit board troubleshooting, HVAC inspection, automotive diagnostics, and energy efficiency audits. Ergonomic lightweight design with anti-slip grip for prolonged use during detailed technical inspections. Advanced image fusion technology combines visible light and thermal data for comprehensive defect identification. Global voltage compatibility (100V-240V) with fast-charging lithium battery for uninterrupted fieldwork.