Universal Phone Board Middle Frame Reballing Magnetic Platform

High-precision magnetic base ensures secure hold during delicate reballing and soldering tasks, preventing slippage for flawless repairs. Made from premium hardened steel with anti-corrosion coating for long-lasting durability.

Universal compatibility with various phone logic boards and middle frames, ideal for micro-soldering, BGA rework, and motherboard-level repairs. Strong magnetic field evenly distributes pressure to avoid PCB warping.

Heat-resistant surface withstands high temperatures during reflow processes, ensuring stability under thermal stress. Non-slip rubber feet provide steady workstation grip for precision handling.

Essential for professional repair shops, electronics engineers, and mobile technicians tackling complex board-level restorations. Streamlines repair workflow with efficient component alignment and hands-free operation.

Bulk pricing available for repair centers needing high-volume equipment. Global wholesale supplier guarantees lowest market prices without compromising industrial-grade quality.