Professional-Grade BGA Repair Station
Precision-engineered with high-temperature resistant alloy and ceramic heating elements for flawless BGA reballing and rework. Equipped with advanced IR preheating and top/bottom thermal control (±2°C accuracy) to prevent PCB warping.
Industrial Efficiency
Optimized for high-volume PCB repairs with adjustable 12-zone heating profiles and automatic cool-down cycle. Ideal for electronics manufacturers, repair labs, and R&D centers requiring repeatable results.
Smart Safety Features
Integrated vacuum pickup arm with anti-static coating and real-time thermal sensors for component protection. Compatible with 15"x15" large boards, supporting QFN, LGA, and all BGA chip sizes.
Lowest Global Wholesale Price
Direct factory pricing ensures unbeatable value for bulk orders. Ships globally with OEM-grade warranty. Upgrade your repair workflow without overpaying.