High-Quality BGA Reballing Platform: Precision-engineered for iPhone X/XS/XS Max motherboard repairs, ensuring optimal alignment and stability during reballing. Durable aluminum alloy construction with anti-slip surface for secure motherboard placement.

Professional-Grade Tooling: Features laser-etched positioning marks and heat-resistant coating (up to 300°C) for accurate BGA chip realignment. Includes adjustable suction cups for hands-free operation.

Multi-Scenario Application: Ideal for microsoldering workshops, logic board refurbishment, and advanced DIY repairs. Compatible with 0.4mm pitch BGA chips and below.

Cost-Efficient Bulk Solution: Wholesale-priced for repair businesses needing reliable, high-volume tools. Hard-anodized finish resists oxidation and extends tool lifespan.

Ergonomic Non-Slip Design: Beveled edges prevent solder spillage, while lightweight frame (180g) enables portable workstation use. Precision-machined with ±0.01mm tolerance for flawless chip seating.