High-Precision BGA Rework Station for iPhone Motherboard Repair
Premium-grade steel alloy construction ensures durability and heat resistance for long-term professional use. Precision-engineered heating nozzles deliver uniform temperature control (±2°C accuracy) for safe BGA chip reballing and soldering. Optimized airflow design prevents motherboard warping during repairs, ideal for iPhone G730 and similar micro-soldering tasks. Includes anti-static ceramic heating plates to protect sensitive components. Designed for repair shops, tech workshops, and DIY enthusiasts handling high-volume motherboard refurbishments. Compact yet powerful, with quick heat-up (under 60 seconds) for efficient workflow. Global wholesale pricing available—bulk orders prioritized with guaranteed lowest rates. Compatible with most BGA chips, backed by industry-leading 12-month warranty.